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| HT-2000 series prevent IC and chip from falling off during double side reflow work and prevent lead falling off phenomena by impact as it increases the fusion strength of solder after reflow work. |
Items |
Viscosity |
Thixotropic Index |
Curing Condition |
| HT-2000S | 350~450 |
Over 3.5 |
Solder Cream Reflow |
| HT-2000S-B | 450~550 |
Over 3.0 |
Solder Cream Reflow |
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Millennium Hi-Tech Corporation Co., Ltd. © 2006 All rights reserved. |
Millennium Hi-Tech Corporation Co., Ltd. 55/39 SoiPrasertmanukit42, Navamin, Bungkum Bangkok 10230 |
