
SEMICONDUCTOR PACKAGING

  A semiconductor package protects an integrated circuit from its environment, feeds power to the IC, draws heat away, and provides a mechanism for data transfer to and from the chip. Essentially, the package enables the chip to do its work.

     Applications for semiconductor packaging are as varied as the chips and their environment. Two common applications, wafer bumping and die attach utilize a variety of thermal processes using nitrogen or hydrogen atmosphere. Packaging requires tight control of process parameters, particularly temperature and atmosphere and a number of solder types can be used.

    To meet the demands of these processes, BTU offers systems with high temperature capability, tight atmosphere control and a variety of atmosphere types. The TCAS achieves oxygen levels down to 2ppm in a hydrogen or nitrogen environment. The Pyramax, with 400^oC maximum temperature, provides very pure nitrogen atmospheres. No matter what your application, BTU provides a product that matches your process.

CONTROLLED ATMOSPHERE FURNACE

Overview
Take your wafer bump reflow process to the next level.

Quality, consistency and control. That’s what you can expect from the BTU Controlled Atmosphere Furnace. Specifically designed to meet wafer-level packaging demands, the TCAS is configured to meet exact process requirements. Available for nitrogen or hydrogen processing or a mixture of both, the TCAS delivers excellent atmosphere purity, high throughput and flux-free continuous processing. The end result is superior efficiency, superior performance, and superior thermal uniformity. So take advantage of the TCAS – and take your wafer bump reflow process to the next level.

STANDARD FEATURES INCLUDE:

Flexible Configurations
Zone lengths and gas barrier positions can be optimized for precise control over one thermal profile or maximum flexibility for multiple profiles.

600^oC Maximum Temperature
Provides the most flexibility for processing eutectic, lead-free, and high lead solders all in one system.

Standard Packaging Configuraton
Achieves O2 levels down to 2ppm, reducing the likelihood of bad solder joints by preventing oxidation.

AVAILABLE OPTIONS INCLUDE:

Automated Wafer Handler Option
200mm and 300mm handling options allow full process automation and yield improvement by preventing contamination and wafer breakage.

Hydrogen Atmospheres up to 95%
System interlocks and a fail-safe gas panel ensure reliable H2 processing for oxide-free solder reflow, eliminating flux and cleaning of bumped wafers.

SEMI S2/S8 Compliance
SEMI S2 and S8 safety and ergonomic standards ensure that equipment meets industry safety requirements.

Specification	Controlled Atmosphere Furnace
Maximum Temperature	600^oC
Atmosphere	Hydrogen
Atmosphere Purity	2 ppm Oxygen
Conveyor Width	18 in (46cm)
Heated Length	81 in (206cm)
Heated Zones	8
Cooling Length	60 in (152cm)
Cooling Zones	2
Overall Length	23 ft (701cm)
Overall Height	48 in (122cm)

Overview | Standard Features | Available Options | Specifications

FLUX COATERS

BTU’s flux coating systems, the SCS608 and SCS812, handle wafers from cassettes or Front Opening Unified Pods, coats them uniformly with flux, and loads them directly onto an in-line reflow oven. To reduce cost and footprint, the flux coaters are designed with special emphasis on process control and configured with an integrated robot wafer handler. A flux coating system combined with a unloading system completes the wafer bump reflow process. Sourcing all components from a single vendor eliminates many of the integration hassles previously experienced.

WAFER HANDLERS

BTU offers a variety of wafer handling systems covering wafer sizes from 100 to 300mm. These systems can be used for both loading and unloading wafers in a flux-free wafer bump reflow application. When a flux wafer bump reflow process is employed the wafer handlers can be used for unloading down stream of a BTU flux coater and reflow oven. The MHS812, a bridge tool for 200 and 300mm wafers, features a 3-axis robot and FOUP load port(s).

The MHS 812, an inline wafer handling system for 200 and 300mm wafers can be integrated with any reflow oven or cleaner. The system is typically used downstream of a flux coating system and a reflow oven. When your application calls for flux free processing, a BTU hydrogen atmosphere conveyor furnace can be paired with the MHS812 for loading and unloading. The system is FOUP compatible and both wafer sizes can be run without any hardware changes. Passive centering of the wafer reduces wafer damage during handling.

WAFER HANDLERS MHS 812

Planet 6500

Planet 6500 - The ULTIMATE AOI system for 10µm – 38µm line / space IC substrates technologies.

Camtek's Planet 6500 is the most advanced IC-substrate AOI system available.
It combines unparalleled detect-ability with exceptionally high throughput.
Planet 6500 utilizes high precision optical and mechanical components to meet all your micro-defect detection needs.

Planet 6500 is the ideal AOI solution for ultra-fine-line PCBs and for advanced IC-Substrates, such as PBGA, CSP, FC-BGA, COF and more.

Planet’s advanced architecture, specially designed to address the demanding challenges of ultra-fine-line inspection.

Pegasus 200S

Pegasus 200S is an advanced Automated Final Inspection (AFI) system dedicated to the inspection of High-Density Interconnect Substrates (HDI-S) such as PBGA & CSP strips and other gold plated applications.

The Pegasus 200S is equipped with a new Broadband CCD camera and with two independent illumination systems; one is optimized for plated metallic surfaces (gold / silver / tin / OTC) and the other for solder mask materials. Its enhanced Image Acquisition system, along with its robust image processing engine, enables the detection of fine defects and micro-cracks on most demanding applications.

	Camtek has developed the Falcon 800 line of advanced measurement and metrology systems for inspecting bumped wafers and ensuring that bumps meet their tight dimensional tolerances. The CTS – Camtek’s Triangulation System (patent-pending) applies a novel approach to the proven triangulation principle that improves accuracy and repeatability on a variety of bumping technologies. Broader angular coverage creates a stronger and more stable reflection from a wide range of bump shapes and materials, supporting 3D analysis of bump topography. The Falcon 800 has been specifically designed for measuring even thefinest gold bumps. Selected high-grade certified mechanical structure and assemblies provide the stability for micron-level measurement at high speeds. The combination of the CTS capabilities, optics and specific algorithms enables meeting even the most demanding gold bump applications. Flip-Chip bumps, including solder, lead-free and copper bumps present a wide variety of shapes and textures, which create high dynamic spectral range and varying reflectivity. The combination of bright field and dark field illumination images these objects with high contrast and details that enable reliable measurement. In addition to CTS, the Falcon 800 can be equipped with CCS – Confocal Chromatic Sensor. This submicron height sensor provides pinpoint precision to verify critical height dimension, or sample gold bump surface roughness or profile. As a metrology instrument, the Falcon 800 has a set of built-in certified calibration and performance targets that are always available for ensuring measurement accuracy. A comprehensive suite of SPC charts and reports supports bump defect and dimension analysis by die, wafer, and lot levels.
Falcon 800

Falcon 500

This high-throughout system is engineered to support in-line 100% inspection at production rates.

Dedicated algorithms analyze probe marks to determine their size, proximity to pad edge and number of touch-downs. When equipped with Camtek’s Confocal Chromatic Height Sensor (CCS), the Falcon 500 can even plot sampled probe mark profiles.

Proprietary optics provides high resolution and contrast. Bright and dark field illuminations bring surface irregularities out while allowing normal process variations. Working together, the Falcon’s optics, illuminations
and sophisticated algorithms provide superb detection with minimal false call rate. Intelligent and intuitive recipe setup adapts detection performance to user preferences.

The Falcon achieves outstanding utilization by enabling line recipe setup and defect review away from the machine, without taking production time.
The Falcon’s off-line simulator displays the effect of various detection parameters and helps optimize the inspection process. Comprehensive suite of SPC tools reports defect distribution by die, wafer and lot levels
supports in process control and yield management.

COMPONENT PLACEMENT WORK CELL

Customers today need a whole solution to their packaging and assembly needs, complete with a manufacturable process—a Component Placement Work Cell (CPWC) is an ideal solution. Equipment flexibility and multi-purposing is an important advantage in today’s environment of doing more with less.

As a Component Placement Work Cell (CPWC), the Model 6500 Precision Die Bonder is designed for fully automatic precision component assembly with 1.5µm placement accuracy (application dependent), making volume component assembly practical and cost effective.

Accuracy and a compact footprint make it easy to fit on your production floor.

THE MODEL 8000 WIRE BONDER

The Model 8000 Wire Bonder is a fully automated thermosonic high-speed ball-and-stitch wire bonder. As the assembly method of choice for first level interconnection, it’s suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high reliability devices. The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, also makes the Model 8000 suitable for flip chip and other advanced packaging applications.

The overall precision of the Model 8000 Wire Bonder results in high yield processing of fine pitch/high wire count applications.

Millennium Hi-Tech Corporation Co., Ltd. 55/39 Navamin Rd., Klong-kum Bangkok 10230
Tel : +66-2508-2051-2 Fax : +66-2508-2053 http://www.millennium-hitech.com E-mail : sales@millennium-hitech.com

SEMICONDUCTOR PACKAGING