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| UNIQUE 305B & 305Y are fast flow, reworkable, one component epoxy for Assembly of BGA & CSP or Flip Chip devices. It is designed to improve the attachment strength of CSP & BGA or Flip Chip devices during mechanical stress testing such as drop and bend testing. |
| * Gap Fill Time : It generated about 3 ~ 4 minute on Slide Glass /PCB(FR-4) with 150micron gap during 'ㄷ‘ character dispensing at room temperature. (Size of Slide Glass : 18mm x 18mm) |
Items |
Viscosity |
Thixotropic Index |
Curing Cond555ition |
| UNIQUE 305B (Underfill) |
15~25 |
- |
Over 130 C 6min.. |
| UNIQUE 305Y (Underfill) |
15~25 |
- |
Over 130 C 6min. |
UNIQUE 306C |
110~130 |
- |
Over 130 C 6min. |
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Millennium Hi-Tech Corporation Co., Ltd. © 2006 All rights reserved. |
Millennium Hi-Tech Corporation Co., Ltd. 55/39 Navamin Rd., Klong-kum Bangkok 10230 |
