MILLENNIUM HI-TECH CORPORATION

PRINTED CIRCUIT BOARD ASSEMBLY

Surface Mount Technology (SMT), reflow soldering is the most widely accepted method of attaching electronic components to a printed circuit board. Applications vary by SMT components, atmosphere and solder type, which dictates the process profile. Finer pitches and challenging materials, particularly, continue to reduce the process window and require optimum thermal reflow performance.
BTU sets the pace in SMT reflow, offering solutions that combine value and performance to lower cost of ownership, meet today’s process and production requirements and deliver higher process yields.
Pyramax ovens provide cost of ownership benefits with low nitrogen and dynamic idle options to reduce nitrogen consumption and flux management systems that increase uptime. Forced impingement convection technology and optional closed loop convection control provides unmatched process consistency and repeatability regardless of the process characteristics.

BTU PYRAMAX REFLOW OVEN

Overview | Standard Features | Available Options | Specifications

    Overview
     Pyramax improves on BTU's industry-leading performance in SMT solder reflow. Pyramax was designed and built with a close eye on what’s next. Fusing performance, versatility, and value, giving you the power to meet current applications and accommodate those of the future.
      Pyramax 150x5, BTU’s fifth-generation surface mount platform, once again sets the industry standard for reduced cost of ownership through reduced power consumption and the lowest available nitrogen consumption. The 10-zone 150x5 is available in both nitrogen and air configurations.
     Pyramax 98 provides 7-zone nitrogen and air processing for the industry’s most cost-effective SMT reflow performance.
     Pyramx 125 provides high volume performance in a reduced footprint. Optimized for lead free processing, delivering maximum process control and repeatability. Reduced nitrogen consumption in combination with our quality features provide manufactures the lowest cost of ownership.
     Pyramax provides BTU customers with the most comprehensive range of products for SMT

STANDARD FEATURES INCLUDE:

Lead-Free Process Ready Guaranteed
Pyramax is ready when you are to handle your lead-free process.

Forced Impingement Convection
BTU's patented forced impingement technology with side-to-side gas recirculation ensures maximum temperature uniformity.

WINCON® Oven Control Software
Windows-based operating software provides user-friendly control, advanced profiling, data collection, programmable event sequencing and host communication.

Innovative Water Cooling System
Closed-loop control provides optimum cooling performance. Sliding heat exchanger allows easy access for preventive maintenance.

Comprehensive Warranty Program
Pyramax is backed by a world-class support including lifetime warranty for heaters and blower motors, three year full system warranty and one year labor warranty.

AVAILABLE OPTIONS INCLUDE:

Closed-loop Convection Control
Used to control both heating and cooling convection rates, Closed-Loop Convection Control maintains constant heat transfer ensuring process repeatability site-to-site, line-to-line and oven-to-oven, facilitating process transfer.

Flux Management
Patented flux removal system reduces scheduled downtime by internally trapping flux, allowing cleaning "on the fly" – while the oven is running. Gas is recirculated back into the process chamber to reduce nitrogen consumption.

Low Nitrogen Package
Reduces nitrogen consumption by 40-50% to significantly reduce operating costs.

Advanced Conveyor Solutions
Dual track conveyors meet the demand for high throughput processing. Fixed and retractable center support options eliminate sagging associated with thin boards.

Smart Tracking SMEMA
Provides product count for given recipe, board drop detection and graphical display of product tracking. Ready/Busy logic provides for upstream and downstream communication.

Electronics Manufacturing Instrument (ECD)

Electronics Manufacturing Instruments

     Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. Getting the temperature up too high or heating the assembly too quickly can result in component damage. Not heating things up enough results in poor soldering and reliability problems.
     ECD manufactures a variety of instruments to assist you in accurately monitoring the time and temperature variables in your electronics manufacturing processes.

Cleaning Product

Providing environmentally safe chemicals for the cleaning of Printed Circuit Assemblies (PCA's)
Components (BGA's and LEDs), Printed Circuit Boards (PCB's), Lead Frames
LCD/precision glass, pre-cleaning prior to conformal coating applications and other high reliability mechanical/electrical fabrications

Enviro Gold # 817 not only cleans Printed Circuit Boards,
it is an excellent stencil cleaner and product
for removing process residues in precision metal

Enviro Gold # 816is a solvent/saponifier in concentrate form
for use in the cleaning of the PCB as well as electronic and precision assemblies.

Dry Cabinet

X2E-1200-4N / X2E-1200-4

X2E-600N / X2E-600

X2E-575N / X2E-575

ADE-1200-6

ADE-480

T40-1200-6N

T40-315N

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Millennium Hi-Tech Corporation Co., Ltd. 55/39 SoiPrasertmanukit42, Navamin, Bungkum Bangkok 10230
Tel : +66-2508-2051-2 Fax : +66-2508-2053 http://www.millennium-hitech.com  E-mail :surasit@millennium-hitech.com