REFLOW OWEN
CUSTOM FURNACES
COMPACT SOLID STATE CHILLERS
SEMICONDUCTOR PRINTING SOLUTION
Surface Mount Technology (SMT) reflow soldering is the most widely accepted method of attaching electronic components to a printed circuit board. Applications vary by SMT components, atmosphere and solder type, which dictates the process profile. Finer pitches and challenging materials, particularly, continue to reduce the process window and require optimum thermal reflow performance.
BTU Pyramax 75 AIR BTU Pyramax 100A BTU Pyramax 100N BTU Pyramax 125A BTU Pyramax 125N BTU Pyramax 150NZ12A BTU Pyramax 150NZ12N BTU Pyramax TRUE FLAT BTU Pyramax ZERO TURN
Pyramax 150n z12 have 12 heated zones and does nitrogen soldering. A soldering nitrogen atmosphere will give you increased joint reliability and performance. Add the Pyramax Profile Guardian and you obtain board level traceability and continuous oven heat monitoring. This top quality nitrogen reflow solder oven have Lifetime Warranty on Heaters and Blowers. Dual Lane / Dual Speed /Dual Center Board Support.
Patented flux removal system reduces scheduled downtime by internally trapping flux, allowing cleaning "on the fly" – while the oven is running. Gas is recirculated back into the process chamber to reduce nitrogen consumption.
Low Nitrogen Package Reduces nitrogen consumption by 40-50% to significantly reduce operating costs.
Advanced Conveyor Solutions Dual track conveyors meet the demand for high throughput processing. Fixed and retractable center support options eliminate sagging associated with thin boards.
Smart Tracking SMEMA Provides product count for given recipe, board drop detection and graphical display of product tracking. Ready/Busy logic provides for upstream and downstream communication.
Very thin substrates can often not withstand thermal processing. Thermal processing can lead to unacceptable board warpage and very low manufacturing yields. TrueFlat technology uses the Pyramax platform to simultaneously employ both convection heating and suction to keep the substrate flat. The suction is applied throughout the entire heating and cooling cycle eliminating the possibility of warpage due to thermal cycling. This technology can be used for board thicknesses from 0.15mm to 0.30mm thick.
BTU’s Exclusive Closed Loop Convection Control Provides Maximum Flexibility in Process Control
This upgrade provides closed loop convection rate adjustment via the WINCON™ operating software.
This is accomplished by monitoring the static pressure in the heating and cooling blower plenums and applying a signal to the frequency controllers to vary the blower frequency of the designated control zones.
This type of control is the most accurate method of controlling the convection rate and gives the widest range of control.
• Ensures process repeatability site to site, line to line and oven to oven • Allows easy adjustment of convection rate for sensitive processes
BTU’s new Energy Pilot reflow oven energy management software enables tremendous savings by using product tracking technology to modify reflow oven performance during gaps in production. BTU’s superior thermal control allows for quick recovery of thermal profile after sleep or stand-by modes.
– Stand-by mode for short interruptions can save over 25% – Sleep mode for longer interruptions can save over 40%
• Reduces electrical, air and nitrogen consumption • Fully automatic operation • Remote product sensor & SMEMA minimize or eliminate recovery time • Easily upgradeable on older equipment