ES-D1

• Compact footprint
• Back-To-Back (BTB) configurable
• Optional shuttle conveyor for BTB
• 3 stages conveyor system

PCB Size: 50 mm x 50 mm – 350 mm x 250 mm
[* Optional 380 mm x 280 mm]
PCB Thickness: 0.3 mm to 6 mm
Stencil Mask Size: 550 mm , 584 mm (23"), 650 mm
Core Cycle Time: 5 sec / under optimized condition
Alignment Accuracy: ±12.5 ㎛ @ 6 sigma
Printing Repeatability: ±25 ㎛ @ 6 sigma , Cmk ≥2.0

ES-D2

• Compact footprint
• Back-To-Back (BTB) configurable
• 23", 29" stencil available
• 3 stages conveyor system

PCB Size: 50 mm x 50 mm - 400 mm x 300 mm
PCB Thickness: 0.3 mm to 6 mm
Stencil Mark Size: 550 mm, 584 mm(23"), 650 mm, 736 mm(29")
Core Cycle Time: 6 sec / under optimized condition
Alignment Accuracy: ±12.5 ㎛ @ 6 sigma
Printing Repeatability: ±20 ㎛ @ 6 sigma , Cmk ≥2.0