THE MODEL 8000 WIRE BONDER

Typical applications include:

Key abilities include:

• Adaptive bond deformation—for ultimate control over ball and stitch deformation which improves bond consistency by reducing variation of size and shape
• Enhanced loop mode—provides exceptional long low loop capability, with loops up to 10mm
• Tailless ball bumping—produces co-planarized gold bumps in a one step process, providing high reliability Au-Au attachment for flip chip applications 
• Traditional wire bonding—from small wire count devices up to large packages with thousands of wires
• Wedge emulation—an alternative to traditional wedge bonding that combines the benefit of Au wire wedge bonding, and the speed, robustness, and other capabilities of a wire bonder

Application Options

The Model 8000 Wire Bonder is an extremely versatile piece of equipment and is the basis of several platforms that can provide specialized functions in addition to traditional applications:

Adaptive Bond Deformation™ (ABD)
More compact designs require finer pitch and lower profiles, which in turn require better control over ball and stitch geometry. Our patented Adaptive Bond Deformation™ technology allows direct and uniform control of ball and stitch deformation, which increases reliability, reduces process development and bond cycle time, and maximizes yields.

Ball Bumping
The Model 8000 Ball Bumper is the only machine that can produce co-planarized gold bumps in one step. Our patented planarBump™ technology uses standard 15-46 micron gold wire to create co-planarized, tailless bumps in a consistent repeatable process with ±2.5 micron wire placement accuracy.

For more information, please refer to “Geometry and Bond Improvements for Wire Ball Bonding and Ball Bumping” that was presented at the Oct2006 IMAPS conference.

Die-to-Die Bonding
The primary benefit of die-to-die bonding is improved performance, higher density, and lower power consumption in mixed signal applications. The Model 8000 can perform IC to IC (die-to-die) interconnection without contacting the bond surface with the use of a security (safety) bond or a stand-off-stitch (SOS). The stand-off-stitch is key to die-to-die interconnection.

Reverse Bonding
The primary benefit of reverse bonding is the ability to form very low height loops for many applications. The Model 8000 can perform substrate to IC (reverse bonding) interconnection without contacting the bond surface with the use of a security (safety) bond or using a stand-off-stitch (SOS).

Tape Automated Bonding (TAB)
Suited for flat panel display, optical, implantable medical devices, and MCMs applications, the main advantage of TAB is the ability to test devices prior to final packaging, accommodating high-density circuits for high pin count devices.

Wedge Emulation
Also known as chain bonding, wedge emulation is an alternative to traditional wedge bonding that uses very precise looping algorithms in a stitch-stitch chain.

Features

The Model 8000 Wire Bonder offers:

• Fully automated assembly—results in extremely high yields and repeatable, predictable electrical performance
• Compact footprint—designed for efficient cleanroom layout (at less than 1 meter sq), it works as a standalone or integrated into a complete SMEMA compatible production line
• Deep access capability—enables wire bonding into packages as deep as 0.750”
• Large bonding area (12”W x 6”D)—accommodates very large packages and wafers, minimizes index time, and improves throughput 
• Software—Bond Data Miner™ (BDM) provides part traceability, predictive process capability, and monitors machine fitness

Equipment Options

Model 8000 Wire Bonder options include equipment for fully automatic substrate handling and special application requirements, such as:

• Push-pull handlers—semi-automatic substrate handling
• Modular and edged-belt conveyors—fully automatic substrate handling
• Software—productivity enhancing tools, like offline programming, SPC tools, and wafer mapping, can be added during build or as need arises
• Custom tooling—Palomar will entertain all customer requests to support complex tooling solutions to address unique package geometries